| 摘要 |
<P>PROBLEM TO BE SOLVED: To enhance adhesive properties of individual chips of a semiconductor device obtained by laminating a plurality of semiconductor chips on a mounting board and to enhance a reliability in the semiconductor device. <P>SOLUTION: An adhesive material 7 made of a resin having thermosetting properties is mainly coated on a semiconductor chip mounting region on a mounting board 1 and a semiconductor chip 3A is mounted. Thereafter, when the adhesive material 7 is cured by heat treatment and is cooled naturally down to a regular temperature, the mounting board 1, etc. are in a convexly curved shape by a difference in α values between the mounting board 1 and the semiconductor chip 3A. Thereafter, a pad P1 is bonded to a pad PA. Thereafter, an adhesive material 9A made of a resin having thermosetting properties is stuck on the semiconductor chip 3A, and a spacer chip 5 is thermo-compressed on its upper part. Thus, the mounting board 1 and the semiconductor chip 3A are almost flattened by heat in thermo-compression, respectively, and the adhesive properties of the semiconductor chip 3A and the spacer chip 5 are enhanced. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
