| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce the profile of an electronic module. <P>SOLUTION: On the flat upper surface 52 of a mutilayer substrate 51, a functional IC 60, a crystal oscillator 61, and a resistor or a capacitor 62 are mounted and covered with a shield case 65. On the flat lower surface 53 of the mutilayer substrate 51, a memory bare IC 66 is mounted and a square frame-like terminal board 70 is soldered to the lower surface 53 of the mutilayer substrate 51. The terminal board 70 has a terminal part 72 for mounting a castellation on the circumference of the lower surface 71a of the square frame-like terminal board body 71. The memory bare IC 66 is contained in a recess 75 formed by the terminal board 70. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
