| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an equipment wherein planarization of the surface of an electronic device is enabled in noncontact manner, and waste fluid is not generated since chemical liquid is not used. SOLUTION: Dry ice particle is made to collide with the surface of the electronic device 1 wherein planarization is to be performed. Etching of the surface of the electronic device is performed by physical energy, and planarization of the surface of the electronic device is performed. At this time, since the dry ice particle has sublimational characteristic, the dry ice particle which arrived at the surface of the electronic device with kinetic energy reaches the inside of surface substance of the electronic device in a wedge shape and receives thermal energy from the electronic device, so that sublimation is performed to gas, and the surface substance of the electronic device is exfoliated by energy of expansion. The exfoliated surface substance of the electronic device is spread in atmosphere together with vaporized dry ice and discharged intensively. The discharged surface substance of the electronic device is subjected to dust collection easily with a filter, an absorption cylinder, etc. COPYRIGHT: (C)2005,JPO&NCIPI
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