| 摘要 |
PROBLEM TO BE SOLVED: To simultaneously satisfy high-density wiring, insulation reliability, and electric continuity reliability in an insulation film formed of an organic material and a multilayer wiring board using the same. SOLUTION: The insulation film 3 is such that coating layers 2 formed of thermosetting resin are formed on both top and bottom faces of a liquid-crystal polymer layer 1. Each of the coating layers 2 comprises a laminate of three or more insulation layers 2a-2c which contain 10-70 vol.% of inorganic insulation powder whose average grain diameter is 0.1-2.8μm. The insulation layers 2a and 2c located in the most outer layers has a smaller content of the inorganic insulation powder than the insulation layer 2b located inside. COPYRIGHT: (C)2005,JPO&NCIPI |
