| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for inspecting double-sided mounting substrate by which the positional deviation or individual form difference of a component mounted on the rear surface of a double-sided mounting substrate can be prevented from being left in the image of the front surface of the substrate extracted from the transmitted X-ray image of the substrate. SOLUTION: The method includes a step (S1) of measuring a double-sided mounting substrate to be inspected and fetching the transmitted X-ray image of the substrate, a step (S2) of only preparing the binary image of a bump region by detecting the edge of the bump region, and a step (S3) of preparing the model image of an expected bump by causing a filter to act on the binary image. The method also includes a step (S5) of obtaining a rear-surface image by differentiating an image to be inspected and the model image of the bump from each other and smoothing the rear-surface image. Then a front-surface image (bump image) only showing the bump image is prepared by subtracting the smoothed rear-surface image from the image to be inspected. COPYRIGHT: (C)2005,JPO&NCIPI
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