MOUNTING STRUCTURE FOR SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a mounting structure for semiconductor device that does not make a semiconductor element mounting method complicated and can prevent the increase of the costs of thin metallic wires. SOLUTION: A damping resistance can be formed easily and inexpensively in a semiconductor device by disposing noise preventing resistive metallic balls at proper places instead of some of mother board joining metallic balls. Since the damping resistance on the printed board of a mother board can be reduced, the mounting density of the mounting structure for semiconductor device can be increased. COPYRIGHT: (C)2005,JPO&NCIPI