| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a low-cost chip-size package by reducing the number of processes without using a metal mold. <P>SOLUTION: The chip-size package comprises a semiconductor chip in which a plurality of electrodes are formed on a surface thereof, a protective film provided on the surface of the semiconductor chip, wirings which are provided at a position different from the position where the electrodes are formed on the protective film so that the electrodes are electrically connected to the outside, bumps provided on the wirings while being at a distance from the electrode, and a resin provided on the surface of the semiconductor chip so that a top surface of the bump is exposed. A cut surface 105 is formed on a side surface of the resin. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
