| 发明名称 |
Method for forming a conductive layer |
| 摘要 |
A method for forming a conductive layer is disclosed, which has the following steps. First, a substrate is provided, and then a patterned photoresist layer having an undercut is formed on the substrate. After that, at least one conductive layer is deposited on the substrate. Finally, the patterned photoresist layer is lifted off; wherein the shape of the conductive layer remaining on the substrate is complementary to that of the patterned photoresist layer.
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| 申请公布号 |
US2004253815(A1) |
申请公布日期 |
2004.12.16 |
| 申请号 |
US20030653080 |
申请日期 |
2003.09.03 |
| 申请人 |
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
SUN YU-CHANG;TANG CHING-HSUAN;LEE CHI-SHEN;SHEU CHAI-YUAN |
| 分类号 |
G02F1/1343;C23C14/06;C23C14/14;C23C16/06;G02F1/1345;G03F7/26;H01B13/00;H01L21/00;H01L21/027;H01L21/28;H01L21/3205;H01L21/336;H01L21/44;H01L21/4763;H01L29/49;H01L29/786;(IPC1-7):H01L21/00 |
主分类号 |
G02F1/1343 |
| 代理机构 |
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