| 摘要 |
Apparatus and method for in-line automation of a semiconductor fabrication process allowing for the selection of a control parameter value that will move a measured workpiece geometry toward a target acceptance range. Such feed-forward and feedback control applies information acquired through inprocess metrology to a downstream and an upstream fabrication step, respectively. In an embodiment, The feed-forward and feedback contorls are provided to the respective fabrication steps via neural networks having as an input a multiple parameter characterization of the workpiece morphology. This integrated system can adapt to a changes in variable that may not be adequately monitored, or whose impact may not be fully appreciated to adjust the process. Metrology devices may be a scanning electron microscoe (SEM), a focused ion beam (FIB) apparatus or a combined SEM-FIB device. |
