| 摘要 |
<p>PURPOSE:To prevent the hindrance resulting from silicon fragments by removing silicon fragments caused by scribing before separating the chip stuck to a fixing tape into individuals by a pickup needle. CONSTITUTION:A fixing tape 1 is stuck to the rear of a wafer 2 so that it may not break up, and it is scribed from the surface side by a blade 3, the wafer 2 is divided into a plurality of chips 4. Next, the first supporting tape 5 is stuck to the surface of the chip 4 so as to fix individual chips 4, and the fixing tape 1 is exfoliated, and the silicon fragments 6 arising at the margins of the cutting faces of the chips 4 are blown off by a removing means 7 consisting of high-pressure jet 7a. Next, the second supporting tape 8 is stuck to the rear of the chips 4 to support the rears of the chips 4, and then the first supporting tape 5 is exfoliated to expose the surfaces of the chips 5.</p> |
