发明名称 PRINTED WIRING BOARD
摘要 <p>PURPOSE:To provide a printed wiring board which can electrically connect electronic parts such as semiconductor elements positively and firmly by preventing a connecting pad from being peeled from an insulating film effectively. CONSTITUTION:An insulating film 2 consisting of a macromolecular material and a circuit wiring film 3 are alternately laminated on an insulating substrate 1, a connecting pad 5 for connecting electronic parts is formed at one part of the circuit wiring film 3, and at the same time a chrome layer 7 is placed on an outer periphery edge A of the connecting pad 5 and is covered with the insulating film 2.</p>
申请公布号 JPH06252539(A) 申请公布日期 1994.09.09
申请号 JP19930035917 申请日期 1993.02.25
申请人 KYOCERA CORP 发明人 KOBAYASHI YASUNORI
分类号 H01L23/12;H05K3/34;H05K3/40;H05K3/46;(IPC1-7):H05K3/34 主分类号 H01L23/12
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