摘要 |
<p>PURPOSE:To provide a printed wiring board which can electrically connect electronic parts such as semiconductor elements positively and firmly by preventing a connecting pad from being peeled from an insulating film effectively. CONSTITUTION:An insulating film 2 consisting of a macromolecular material and a circuit wiring film 3 are alternately laminated on an insulating substrate 1, a connecting pad 5 for connecting electronic parts is formed at one part of the circuit wiring film 3, and at the same time a chrome layer 7 is placed on an outer periphery edge A of the connecting pad 5 and is covered with the insulating film 2.</p> |