CALCULATION ELEMENT AND MANUFACTURE THEREOF

摘要

PURPOSE: To directly mutually connect integrated circuit devices regardless of the number by electrically connecting them so as to be overlapped, mounting the integrated circuit devices on the surface of plural bendable substrate layers enabling one to be independently connected with another devices. CONSTITUTION: Plural substrates layers 12A are provided on one face of power supplying and supporting means (power plane) 10 of a calculating element 1, and integrate circuit devices 14 are arranged on one face of a substrate layer 12 connected with the opposite side of the power plane 10. The integrated circuit devices 14 are connected through an input and output connecting point 9 with the power plane 10 and the other integrated circuit devices 14. Moreover, a through-hole is formed on the adjacent substrate 12, and the integrate circuit devices 14 are mutually connected with each desired substrate layer 12 and the power plane 10. The substrate 12 adjacent to the power plane 10 is hardly fixed, and the substrate 12 separated from the power plane 10 and extended outside is easily bendable.