| 摘要 |
PROBLEM TO BE SOLVED: To prevent a degradation in soldering finish without raising a temperature of soldering and prolonging the time required for the contact between the solder and the back side of a board, and to prevent a solder flowing over the surface of the conveyed board even if the solder flow is raised. SOLUTION: A movable cover 29 for shutting the spouting solder is provided at an upper part in a solder spouting direction of the spouting nozzle 11 and the solder spouting from the nozzle 11 is shut off by the cover 29 until a tip 9a of a printed wiring board 9 in a conveying direction passes through the nozzle 11. After the tip 9a of the board 9 in the conveying direction passes through the nozzle 11, the shutting out operation of the cover 29 is released to contact the spouting solder to the soldering point of the board 9. COPYRIGHT: (C)2005,JPO&NCIPI
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