发明名称 LIQUID DROPLET EJECTION MANUFACTURING DEVICE, PATTERN CIRCUIT BOARD MANUFACTURED THEREBY, AND DEVICE BOARD
摘要 PROBLEM TO BE SOLVED: To manufacture a high quality, precise pattern circuit board or device board in high yield. SOLUTION: In this liquid droplet manufacturing device, a surface roughness of the face of the board 14 on which a pattern is formed is made to be greater than a size of a fine particle and a surface roughness of the rear face thereof is made to be greater than that of the face on which the pattern is formed. When the size of the fine particle is represented by Dp and a diameter of an ejection nozzle is by Do, the expression: 0.0001≤Dp/Do≤0.01 is satisfied. A shape of a droplet in the flying is made to be roughly a ball just before it is deposited on the face of the board 14 or a cylindrical shape which is extended in the flying direction, the length being within a triple of the diameter, and the flying droplet is made not to have a plurality of fine droplets at the rear side thereof. The board 14 and an ejection head 33 are relatively moved in the orthogonally intersecting two directions. A pattern is formed by combining dots formed of liquid droplets 43 and made to be in a band like pattern extended in the orthogonally intersecting directions. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004345241(A) 申请公布日期 2004.12.09
申请号 JP20030145264 申请日期 2003.05.22
申请人 RICOH CO LTD 发明人 SEKIYA TAKURO
分类号 B41J2/01;B05C5/00;B05D1/26;B41J2/045;B41J2/055;H05K3/10;(IPC1-7):B41J2/045 主分类号 B41J2/01
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