A dielectric substrate (88) has a conductive via between front and back surfaces in thickness direction, without forming an air gap between the conductive via and the substrate end and without electrical interconnection with a conductive shield covering the major area of the conductive signal trace (92) supported on upper surface of substrate. A contact is electrically connected to the conductive via.
申请公布号
WO2004107401(A2)
申请公布日期
2004.12.09
申请号
WO2004US12806
申请日期
2004.04.26
申请人
CASCADE MICROTECH, INC.;GLEASON, K., REED;LESHER, TIM;ANDREWS, MIKE;MARTIN, JOHN
发明人
GLEASON, K., REED;LESHER, TIM;ANDREWS, MIKE;MARTIN, JOHN