| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which the reliability of wirings when electrodes provided on the surfaces of semiconductor pellets or the electrodes and a board or the like are connected, are improved. <P>SOLUTION: The semiconductor device is equipped with semiconductor pellets 106 and 107 provided with electrodes on their front surfaces and a connection plate 111. The connection plate 111 is provided with a first main surface where non-conductive layer patterns 112 and conductive layer 113 formed between the non-conductive layer patterns 112 are formed and which is provided over the above electrodes in face to face with them and connected to the electrodes through the intermediary of the conductive layers 113. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
