Using solder balls of multiple sizes to couple one or more semiconductor structures to an electrical device

摘要

In one embodiment, solder balls of multiple sizes may be used to couple one or more semiconductor structures to an electrical device. For example, a printed circuit board structure may support one or more integrated circuit packages includes at least one package with a substrate having a bottom surface. The structure may also include a printed circuit board that includes: (1) one or more first regions each having a top surface opposite the bottom surface of the substrate and separated from the bottom surface by a first distance; and (2) one or more second regions each having a top surface opposite the bottom surface of the substrate and separated from the bottom surface of the substrate by a second distance, the top surface of the second region being closer to the bottom surface of the substrate than the top surface of the first region such that the second distance is smaller than the first distance. One or more first solder ball may be used to couple the substrate to the board at the first regions, and one or more second solder balls that are smaller than the one or more first balls may be used to couple the substrate to the board at the second regions, the first and second balls providing electrical connectivity between circuitry associated with the package and circuitry associated with the board.