| 摘要 |
The electronic device comprises a thin-film transistor (10) and can be obtained from two substrates (1, 11). In order to preclude delamination at a non-adhesive interface between a metal pattern (24, 29) and an organic layer (4), the metal pattern (24, 29) comprises apertures (30). Through these apertures (30), adhesion between the organic layer (4, 5) and organic material at the surface (111) of one of the substrates (11) can be brought about. The electronic device can be manufactured by means of microcontact printing.
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