| 摘要 |
The invention relates to an arrangement for the soldering of a metal block (12) by the jointing of a number of segment sheets (12/i), whereby solder material (18) forms a whole-surface material connection with low layer thickness in capillary soldering gaps (14/j) formed between adjacent segment sheets (12/I). In order to fix the segment sheets (12/i) in base form with the configuration for the permanent connection by soldering, rod-like fixing elements (15/1 to 15/4) are provided, passing through adjacent segment sheets (12/i), through openings (16/1 to 16/4) which open out into each other and hold the segment sheets (12/i) together in the given arrangement by means of the positive fit thereof. The solder material (18) is prepared in deposit chambers, connected to the solder gaps (147j). The fixing elements (15/1 to 15/4) serve as carrier for solder material (18), applied to the fixing element such that, with the segment sheets (12/i) and the fixing elements (15/1 to 15/4) in the pre-fixing configuration, the solder material (18) is maintained in frictional contact with the opening edge regions of the segment sheet openings (16/1 to 16/4) to both sides of the solder gaps traversed by the fixing elements (15/1 to 15/4). |
