发明名称 Semiconductor device, and production method for manufacturing such semiconductor device
摘要 A semiconductor device includes a first conductivity type semiconductor substrate. A first conductivity type drift layer is formed on a surface of the first conductivity type semiconductor substrate, and a second conductivity type base region is produced in the first conductivity type drift layer. The second conductivity type base region has a trench formed in a surface thereof. A trench-stuffed layer is formed by stuffing the trench with a suitable material, and a second conductivity type column region formed in the first conductivity type drift layer and sited beneath the trench-stuffed layer. A first conductivity type source region is produced in the second conductivity type base region, and both a gate insulating layer and a gate electrode layer are produced so as to be associated with the first conductivity type source region and the first conductivity type drift layer such that an inversion region is defined in the second conductivity type base region in the vicinity of both the gate insulating layer and the gate electrode layer.
申请公布号 US2004245570(A1) 申请公布日期 2004.12.09
申请号 US20040833055 申请日期 2004.04.28
申请人 NEC ELECTRONICS CORPORATION 发明人 NINOMIYA HITOSHI
分类号 H01L29/78;H01L21/336;H01L29/06;H01L29/10;H01L29/76;(IPC1-7):H01L29/76 主分类号 H01L29/78
代理机构 代理人
主权项
地址