发明名称 Semiconductor device and method of manufacturing the same, electronic device and method of manufacturing the same, and electronic instrument
摘要 A semiconductor device including: a semiconductor substrate in which an integrated circuit is formed; an insulating layer formed on the semiconductor substrate and having a first surface and a second surface which is higher than the first surface; a first electrode formed to avoid the second surface and electrically connected to the inside of the semiconductor substrate; and a second electrode formed on the second surface and electrically connected to the inside of the semiconductor substrate.
申请公布号 US2004245612(A1) 申请公布日期 2004.12.09
申请号 US20040828101 申请日期 2004.04.19
申请人 SEIKO EPSON CORPORATION 发明人 HASHIMOTO NOBUAKI
分类号 H01L23/52;G02F1/1345;H01L21/00;H01L21/3205;H01L21/56;H01L21/60;H01L23/12;H01L23/485;H01L23/525;(IPC1-7):H01L21/00 主分类号 H01L23/52
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