发明名称 |
Semiconductor device and method of manufacturing the same, electronic device and method of manufacturing the same, and electronic instrument |
摘要 |
A semiconductor device including: a semiconductor substrate in which an integrated circuit is formed; an insulating layer formed on the semiconductor substrate and having a first surface and a second surface which is higher than the first surface; a first electrode formed to avoid the second surface and electrically connected to the inside of the semiconductor substrate; and a second electrode formed on the second surface and electrically connected to the inside of the semiconductor substrate. |
申请公布号 |
US2004245612(A1) |
申请公布日期 |
2004.12.09 |
申请号 |
US20040828101 |
申请日期 |
2004.04.19 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
HASHIMOTO NOBUAKI |
分类号 |
H01L23/52;G02F1/1345;H01L21/00;H01L21/3205;H01L21/56;H01L21/60;H01L23/12;H01L23/485;H01L23/525;(IPC1-7):H01L21/00 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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