| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer supporting fixture suitable for heat treatment of a high quality and large diameter wafer by supporting the flexure deformation of wafer and its tare flexed at the time of heat treatment in multiple manner as a distributed load of non-concentration. SOLUTION: In the wafer supporting fixture A for heat treatment which supports a semiconductor wafer w of horizontal arrangement from below, a plurality of linear curvature type supporting sections 1 which bend toward the center direction from a predetermined position 2 of an outer peripheral part 10 are formed in inner hollow of an outer peripheral part 10. Corresponding to bending reproduced by tare of the wafer w laid upwards or heat treatment of the wafer w which is mounted on a plurality of curvature type supporting sections 1, the curvature type supporting section 1 is constituted as a soft structure capable of displacement in the vertical direction. COPYRIGHT: (C)2005,JPO&NCIPI |
