| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of chips having solder bumps whereby, when forming solder bumps in the chips present in the state of an aggregate substrate, the bump having a large height can be formed in each corner portion of each chip. SOLUTION: The manufacturing method of chips having solder bumps is manufactured by a process for so forming electrodes on an aggregate substrate as to arrange the electrodes rectangularly along the respective sides of each chip, a process for printing solder pastes by using a printing mask having opening portions in the positions corresponding to the respective electrodes, a process for forming solder bumps on the electrodes by subjecting the aggregate substrate having the printed solder pastes to a heat treatment, and a process for so cutting thereafter the aggregate substrate longitudinally and laterally as to manufacture the chips having the solder bumps. Hereupon, the corresponding opening positions of the printing mask to the electrodes of each chip wherefrom the electrodes of its corner portions are excluded are so formed that their widths are made wider than the ones of the electrodes in the nearly orthogonal direction to its electrode arranging direction and their dimensions are made nearly equal to the ones of the electrodes in its electrode arranging direction. Further, the center positions of the two opening portions corresponding to the two electrodes adjacent to each corner portion of each chip are offset in the nearly orthogonal direction to its electrode arranging direction, with respect to the centers of the corresponding electrodes thereto. Moreover, the directions of these offsets are so set as to have the same sense in the circumferential direction of each chip. COPYRIGHT: (C)2005,JPO&NCIPI
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