发明名称 METHOD AND APPARATUS FOR ION BEAM ETCHING
摘要 PROBLEM TO BE SOLVED: To provide a method and an apparatus for ion beam etching which can improve the productivity by simplifying the manufacturing process and which is suitable for being used in manufacturing an optical device. SOLUTION: The method of ion beam etching includes a step of oppositely disposing a mask member 20 having an opening 21 formed to define the working region of an ITO (indium tin oxide) film 12 on a substrate 10 to be processed, and illuminating an ion beam IB to the ITO film 12 via the mask member 20 to etch the ITO film 12. Thus, since the formation of a resist mask to the ITO film 12 and its removing step become unnecessary, the number of substrate processing steps for etching can be remarkably reduced to improve the productivity. Since the resist mask is not used, the deterioration of the surface properties of the ITO film 12 can be avoided, and the optical device having excellent optical characteristics can be manufactured. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004349367(A) 申请公布日期 2004.12.09
申请号 JP20030142967 申请日期 2003.05.21
申请人 ULVAC JAPAN LTD 发明人 NISHIBASHI TSUTOMU;TSUGE HIROYUKI;TERASAWA HISAHIRO
分类号 H01L21/302;(IPC1-7):H01L21/302 主分类号 H01L21/302
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