METHOD FOR REUSING RESIDUAL DIES AFTER SEPARATING ONE DIE FROM ELASTOMER IN DIE BONDING PROCESS

摘要

PURPOSE: A method for reusing residual dies after separating one die from an elastomer in a die bonding process is provided to increase a yield of die by performing the die bonding process for the residual dies without loss of dies. CONSTITUTION: A coupling die removal process is performed to remove a coupling die(S21). An adhesive film is adhered on an upper active region of a wafer(S22). A mounting tape and an elastomer are removed from a lower field region of the wafer(S23). A cleaning process for the lower field region of the wafer is performed(S24). A plasma process for the lower field region of the wafer is performed(S25). A new elastomer and a new mounting tape are adhered on the lower field region of the wafer(S26).