CONDITIONER ASSEMBLY OF CMP APPARATUS FOR SEMICONDUCTOR WAFER FOR IMPROVING PROFILE OF SURFACE OF POLISHING PAD

摘要

PURPOSE: A conditioner assembly of a CMP apparatus for semiconductor wafer for improving a profile of a surface of a polishing pad is provided to prevent damage and deformation due to physical force applied from the polishing pad by using the first gimbal and the second gimbal. CONSTITUTION: A rotary shaft is rotatably supported by a conditioner head. The first gimbal(30a) having a shape of plate is fixed to an end part of the rotary shaft. The first gimbal is opposite horizontally to the polishing pad. The second gimbal is opposite to a bottom face of the first gimbal. A diamond disk is installed on a lower part of the second gimbal. A guide part is used for transmitting rotatory power to the second gimbal on the basis of the first gimbal and guiding the top/down sliding movement. An elastic bodies(36a,36b) are supported from the bottom face of the first gimbal and provides elastic force to a lower direction of the second gimbal. A clamp is supported by the first gimbal and is used for limiting the sliding distance to the lower direction of the second gimbal.