摘要 |
The design consists of the shape of the interconnect shown in the drawings.Drawings of the design are included, in which:Fig. 1 is a perspective view of the front, right side, and top of an interconnect incorporating the new design;Fig. 2 is a front elevational view thereof;Fig. 3 is a right-side elevational view thereof, with the left-side elevational view being a mirror image of Fig. 3;Fig. 4 is a rear elevational view thereof;Fig. 5 is a top plan view thereof; andFig. 6 is a bottom plan view thereof.Fig. 7 is a perspective view of the front, right side, and top of an interconnect incorporating a variant of the design shown in Figure 1;Fig. 8 is a front elevational view thereof;Fig. 9 is a right-side elevational view thereof, with the left-side elevational view being a mirror image of Fig. 9;Fig. 10 is a rear elevational view thereof;Fig. 11 is a top plan view thereof; andFig. 12 is a bottom plan view thereof. |