LEAD FRAME AND SEMICONDUCTOR DEVICE HAVING RESIN-CAPSULIZED SEMICONDUCTOR CHIP LOADED ON THE SAME

摘要

PURPOSE: A lead frame and a semiconductor device having a resin-capsulized semiconductor chip loaded on the same is provided to prevent a breakdown of a bonding wire due to a crack of a molding resin in a heating process when the semiconductor device is loaded on a circuit board. CONSTITUTION: A lead frame(1) includes a die stage and a plurality of cut parts. A semiconductor chip(8) is loaded on the die stage(2). The cut parts are formed on an outer circumference of the die stage. An exterior of the die stage is smaller than an exterior of the semiconductor chip. The die stage and the semiconductor chip are surrounded within a molding resin(9) which is introduced into the cut parts of the die stage.