发明名称 RESIN SEALED SEMICONDUCTOR DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To increase a strength of a lead without increasing self-inductance and self-capacitance of the lead by a method wherein a portion to which adhesives of an inner lead are not adhered is twisted. SOLUTION: As an inner lead 203 is twisted, a strength in upper and lower directions of the inner lead 203 can be increased. For this reason, it is possible to suppress a deformation of the lead due to a stress of injection resin caused conventionally when a resin sealing step is performed. Further, as the inner lead 203 is twisted, a width of the inner lead 203 is apparently fined. Therefore, it is possible to reduce self-inductance and self-capacitance of the inner lead 203. Moreover, as a space of the adjacent inner lead 203 is widened due to the twisting, it is possible to reduce mutual inductance and mutual capacitance between the adjacent leads, and to enhance manufacturing yield and performance.</p>
申请公布号 JPH09260569(A) 申请公布日期 1997.10.03
申请号 JP19960067626 申请日期 1996.03.25
申请人 TOSHIBA CORP 发明人 ISHIKAWA HISAMITSU;ISHIMURA SHUICHI
分类号 H01L23/50;(IPC1-7):H01L23/50 主分类号 H01L23/50
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