| 摘要 |
PURPOSE: A semiconductor package is provided to achieve a thin package structure by connecting adjacent semiconductor chips with each other on the same plane instead of stacking the semiconductor chips with each other. CONSTITUTION: A semiconductor package includes a first semiconductor chip(20) with a plurality of first bonding pads(a1-a9), a second semiconductor chip(30) with a plurality of second bonding pads(b1-b9), a planarized layer with openings for exposing the first and second bonding pads, and a plurality of metal patterns(c1-c8) for connecting the first bonding pads with the second bonding pads. The first semiconductor chip is next to the second semiconductor chip on the same plane.
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