| 摘要 |
PROBLEM TO BE SOLVED: To enable the quick and reliable contact by placing conductive pads between matched contact pads and electrically contact first board contacts to second board contacts. SOLUTION: A flip chip 10 comprises bond pads 12, 14 on the upper surface 16 of a die 11 of the chip 10. An organic protective layer 18 is formed on the surface 16 of the chip 10 by the screen printing, etc. First conductive and superposable layers 20, 22 are selectively formed on the bond pads 12, 14 and second conductive and superposable layers 24, 26 are selectively formed on the first layers 20, 22. All these layers form bumps 28, 30 on the chip 10. The bumps 28, 30 on the chip 1 are disposed at bond pads 32, 34 on a board 36 to contact them. By heating method etc. the bumps 28, 30 are superposed to form electric connections between the bond pads 12, 14 on the chip and those 32, 34 on the board. |
