发明名称 Semiconductor device and method of fabricating the same
摘要 A semiconductor device and a fabricating method thereof, capable of suppressing diffusion of hydrogen into a device and also capable of maintaining high performance are provided, while a passivation film is formed in a device whose performance is easily deteriorated by hydrogen diffusions. The semiconductor device is comprised of: a semiconductor substrate; a ferroelectric capacitor formed on the semiconductor substrate; a first interlayer film containing the ferroelectric capacitor; and a passivation film formed on the first interlayer film; in which a hydrogen diffusion preventing film is formed under the passivation film, and substantially adjacent to this passivation film. Also, the method for fabricating the semiconductor device is comprised of at least a step for forming a hydrogen diffusion preventing film under a passivation film and also substantially adjacent to this passivation film.
申请公布号 US6828189(B2) 申请公布日期 2004.12.07
申请号 US20020106100 申请日期 2002.03.27
申请人 OKI ELECTRIC INDUSTRY CO., LTD. 发明人 IGARASHI YASUSHI
分类号 H01L21/318;H01L21/02;H01L21/822;H01L21/8242;H01L21/8246;H01L27/04;H01L27/105;H01L27/115;(IPC1-7):H01L21/824 主分类号 H01L21/318
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