METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING IMPROVED SOLDER RESIST PATTERN AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PURPOSE: A method of manufacturing a semiconductor package and a method of manufacturing a semiconductor device are provided to prevent melted solder bump from penetrating into an interface between a first pad and a solder resist pattern and to restrain electrical short between solder bumps by exposing all the sides of the first pad through the solder resist pattern. CONSTITUTION: A first conductive pattern with a first pad(7a) is formed on one surface of an insulating substrate. A second conductive pattern with a second pad is formed on the other surface of the insulating substrate. A solder resist pattern(9) with an opening capable of exposing all the sides of the first pad is formed on one surface of the insulating layer. A semiconductor device is electrically connected with the first pad via a first solder bump(12). An insulating adhesive(13) is interposed between the semiconductor device and the substrate.