| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad with which a wafer flatly can be polished, in the polishing pad having a window member. <P>SOLUTION: The window member 30 of the polishing pad 20 is formed in a rectangular shape having the same width in a longitudinal direction. Its length L is formed in a length exceeding the diameter D of the surface to be polished of the wafer W. Thus, since the surface to be polished of the wafer W to be polished by the polishing pad 20 is affected by the influence of the window member 30 in the entirety, the entire surface to be polished is polished flatly. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
