发明名称 Ion implantation phase shift mask
摘要 The mask includes a substrate formed of a material having a first index of refraction and a first level of transmittance to a wavelength of light with which the phase shift mask is designed for use. Second portions of the substrate are impregnated with a dopant species, leaving first portions of the substrate unaffected by the dopant species. The second portions of the substrate have a second index of refraction and a second level of transmittance to the wavelength of light. The first index of refraction is not equal to the second index of refraction. The second portions of the substrate shift a phase of the light relative to the first portions of the substrate and thereby increase an effective imaging resolution of the phase shift mask. In this manner, instead of using an etch process or a deposition process to form phase shifting regions of the mask, a doping processing is used instead. Most preferably, an ion implantation process is used. As ion implantation tends to be extremely well behaved and controllable, the mask according to the present invention has phase shifting regions that can be formed with a high degree of control and uniformity across the mask substrate.
申请公布号 US2004241554(A1) 申请公布日期 2004.12.02
申请号 US20030447381 申请日期 2003.05.29
申请人 LSI LOGIC CORPORATION, MILPITAS, CA 发明人 RISSMAN PAUL;EIB NICHOLAS K.;MAY CHARLES E.
分类号 B44C1/22;C03C15/00;C03C25/68;C23F1/00;G03F1/00;G03F9/00;H01L21/76;(IPC1-7):H01L21/76 主分类号 B44C1/22
代理机构 代理人
主权项
地址