METHOD OF FORMING THIN FILM WITH UNIFORM THICKNESS USING TWO-STEP FILM FORMING PROCESSES AND APPARATUS FOR THE SAME

摘要

PURPOSE: A method of forming a thin film and an apparatus for the same are provided to improve the uniformity of thickness in the thin film by performing alternately a first thin film forming process and a second thin film forming process on a substrate. CONSTITUTION: A substrate is loaded in a chamber(100). A first thin film is formed on the substrate by introducing a first process gas to a first direction(105) in the chamber. A second thin film is formed on the first thin film by introducing a second process gas to a second direction(106) in the chamber. At this time, the second direction is opposite to the first direction. The first and second direction are horizontal direction to the substrate.