发明名称 Method and system for sensing IC package orientation in sockets
摘要 An embodiment of this invention provides a system and method for indicating the orientation of a packaged IC in a socket. An LED is physically mounted to a socket. One lead of the LED is electrically connected to a positive voltage through a socket hole on the socket. When the orientation of the IC package in the socket is correct, the other lead of the LED is connected to a ground path on the packaged IC. As a result, the LED is activated indicating the orientation of the packaged IC is correct.
申请公布号 US2004242053(A1) 申请公布日期 2004.12.02
申请号 US20040888898 申请日期 2004.07.08
申请人 BENAVIDES JOHN A.;ADKISSON RICHARD W. 发明人 BENAVIDES JOHN A.;ADKISSON RICHARD W.
分类号 H05K7/10;(IPC1-7):H01R3/00 主分类号 H05K7/10
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