| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a fixed abrasive grain polishing pad and a method of polishing a silicon wafer using the fixed abrasive grain polishing pad prevented from the detachment of abrasive grains and improved in polishing efficiency. <P>SOLUTION: This fixed abrasive grain polishing pad for polishing the silicon wafer by relative motion to the silicon wafer by pressing the silicon wafer while supplying an alkaline solution as a polishing fluid between the silicon wafer and the polishing pad, is composed of at least a polyurethane binder comprising a hard segment and a soft segment, and abrasive grains having a hydroxyl group, or abrasive grains supplied with the hydroxyl group, wherein the molecular weight of the hard segment is in a range of 20% to 60% of the whole at a molecular weight ratio. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
