发明名称 |
Heating device for manufacturing semiconductor |
摘要 |
A heating device for manufacturing semiconductor capable of uniformly heating a wafer or other materials to be treated, and in particular a heating device in a coater-developer used for heat-hardening of resin film for photolithography and for heat-calcining of low-dielectric constant insulating film, is provided. A device of this invention comprises a ceramic holder 1 having a resistive heating element 2 embedded therein, which holds and heats a wafer 6 or another material to be treated; a cylindrical support member 4 which supports the ceramic holder 1; and a chamber 5 which houses these. The support member 4 and ceramic holder 1 are not hermetically sealed, or alternatively the atmospheres within the cylindrical support member 4 and within the chamber 5 are maintained to be substantially the same by adjusting the introduction and evacuation of gas.
|
申请公布号 |
US2004238520(A1) |
申请公布日期 |
2004.12.02 |
申请号 |
US20040489174 |
申请日期 |
2004.03.10 |
申请人 |
KUIBIRA AKIRA;NATSUHARA MASUHIRO;NAKATA HIROHIKO |
发明人 |
KUIBIRA AKIRA;NATSUHARA MASUHIRO;NAKATA HIROHIKO |
分类号 |
H01L21/683;H01L21/00;H01L21/027;(IPC1-7):F27D11/00;H05B3/68 |
主分类号 |
H01L21/683 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|