发明名称 HIGH FREQUENCY INDUCTION HEATING DEVICE AND SEMICONDUCTOR FABRICATION DEVICE
摘要 PROBLEM TO BE SOLVED: To achieve easy formation of a temperature distribution and a temperature gradient of an object to be heated, which has been difficult so far, in an induction heating system. SOLUTION: There are provided a plurality of work coils 40a, 40b divided into zones for induction-heating the object to be heated, a power supply 20 for high frequency induction heating to supply power to the work coils 40a, 40b, and a control means 30 for individually controlling power supplied to the work coils 40a, 40b from the power supply 20. The control means 30 comprises: a plurality of impedance matching circuits 32a, 32b provided to correspond to the work coils 40a, 40b; and a time-division control means 31 for supplying power from the power supply 20 to the work coils 40a, 40b on a time-division basis via the respective matching circuits corresponding to the work coils 40a, 40b. The time-division control means 31 is made up of: a matching circuit switching device 35 for switching the plurality of matching circuits 32a, 32b; and a dime-division oscillation control circuit 34 for switching the switching device 35 in synchronization with the frequency of the power supply 20. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004342450(A) 申请公布日期 2004.12.02
申请号 JP20030137448 申请日期 2003.05.15
申请人 KOKUSAI ELECTRIC SEMICONDUCTOR SERVICE INC 发明人 ISHIZU HIDEO;SUZUKI MASAYUKI
分类号 H05B6/44;C23C16/46;C30B15/14;H01L21/205;H05B6/04;H05B6/06;(IPC1-7):H05B6/44 主分类号 H05B6/44
代理机构 代理人
主权项
地址