INJECTION-MOLDED IMAGE SENSOR STRUCTURE USING INJECTION-MOLDED STRUCTURE AS FRAME LAYER AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: An injection-molded image sensor structure and a manufacturing method thereof are provided to embody mass-production and to prevent the degradation of wire connection due to a glue by forming a frame layer using an injection-molding manner. CONSTITUTION: An image sensor is electrically connected to a PCB(Printed Circuit Board)(52). The image sensor includes metal sheets, an injection-molded structure. a photosensitive chip, wires, and a transparent layer. Each metal sheet(30) includes a first board(40). The injection-molded structure includes a first molded body(44), a second molded body(46), and a cavity(48). The photosensitive chip(34) with a plurality of bonding pads(56) is installed in the cavity of the injection-molded structure. The wire(36) is used for connecting electrically the bonding pad of the chip to the first board of the metal sheet. The transparent layer(38) is installed on the first molded body to cover the chip.