发明名称 PRINTED CIRCUIT BOARD IN WHICH COOLING OF ELECTRIC COMPONENT IS IMPROVED
摘要 PROBLEM TO BE SOLVED: To provide an improved method of cooling an electric component mounted on a printed circuit board. SOLUTION: The printed circuit board is provided with a through hole 6 between an upper side 3 and a lower side 7 of the board main body, and is provided with at least one electric component 2 installed in the upper side 3, and at least one thermally conductive member 8 inserted into the through hole 6, extending from the upper side 3 to the lower side 7 and thermally combined with the electric component 2. The thermally conductive member 8 is provided with a flat upper part, and a lower part which is tapered or in which a recess is provided. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004343112(A) 申请公布日期 2004.12.02
申请号 JP20040141294 申请日期 2004.05.11
申请人 AGILENT TECHNOL INC 发明人 MUELLER MARCUS
分类号 H05K7/20;H01L23/367;H05K1/00;H05K1/02;H05K3/40;H05K3/42;(IPC1-7):H05K1/02 主分类号 H05K7/20
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