| 摘要 |
PROBLEM TO BE SOLVED: To obtain a built-up multilayer printed circuit board having proper resin filling in the IVH (interstittial via-hole) of an inner layer plate, excellent surface unevenness, excellent heat resistance and reliability and proper elastic modulus. SOLUTION: The multilayer printed circuit board has a structure in which organic resin composition layers are formed on the front and rear surfaces of an inner layer plate having the IVH to fill the IVH, and an outermost layer is formed with the organic film base material-reinforced resin composition layer. Thus, the resin is filled in the IVH. Higher elastic modulus than the multilayer printed circuit board in which the build-up laminated only with the resin layer is obtained. The printed circuit board has excellent surface unevenness, excellent heat resistance, and migration resistance as compared with the multilayer printed circuit board manufactured only by a prepreg. COPYRIGHT: (C)2005,JPO&NCIPI |
