CHEMICALLY AMPLIFIED POSITIVE PHOTO RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN
摘要
<p>A chemically amplified positive photo resist composition, characterized in that it comprises (A) an alkali-soluble resin containing a hydroxystyrene based constituting unit (a1) and a styrene based constituting unit (a2), (B) crosslinking agent, (C) an acid generator and an organic solvent; and a method for forming a resist pattern which comprises using the resist composition. The photo resist composition can form a resist exhibiting high sensitivity, high heat resistance and high resolution (high contrast) and being reduced in undulation phenomenon.</p>
