发明名称 SiGe lattice engineering using a combination of oxidation, thinning and epitaxial regrowth
摘要 The present invention provides a method of fabricating a SiGe-on-insulator substrate in which lattice engineering is employed to decouple the interdependence between SiGe thickness, Ge fraction and strain relaxation. The method includes providing a SiGe-on-insulator substrate material comprising a SiGe alloy layer having a selected in-plane lattice parameter, a selected thickness parameter and a selected Ge content parameter, wherein the selected in-plane lattice parameter has a constant value and one or both of the other parameters, i.e., thickness or Ge content, have adjustable values; and adjusting one or both of the other parameters to final selected values, while maintaining the selected in-plane lattice parameter. The adjusting is achieved utilizing either a thinning process or a thermal dilution process depending on which parameters are fixed and which are adjustable.
申请公布号 US2004242006(A1) 申请公布日期 2004.12.02
申请号 US20030448954 申请日期 2003.05.30
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 BEDELL STEPHEN W.;CHEN HUAJIE;FOGEL KEITH E.;SADANA DEVENDRA K.
分类号 H01L21/20;H01L21/762;(IPC1-7):H01L21/302;H01L21/461 主分类号 H01L21/20
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