| 摘要 |
PROBLEM TO BE SOLVED: To provide a process for fabricating a multilayer ceramic capacitor 10 in which contact reliability of an inner electrode 24 (24a, 24b) between ceramic layers 22 and a via electrode 28 is enhanced. SOLUTION: The multilayer ceramic capacitor 10 is fabricated by laying the ceramic layer 22 and the inner electrode layer 24 alternately and integrating them into a multilayer sheet 100, forming a through hole 26 in the multilayer sheet 100 using a laser, and then forming a via electrode 28 by filling the through hole 26 with a conductive material using a filling container 110. The through hole 26 is pressure filled with the conductive material from the opening. COPYRIGHT: (C)2005,JPO&NCIPI
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