发明名称 Method of forming a self-aligned contact structure using a sacrificial mask layer
摘要 Disclosed is a method of forming a self-aligned contact structure using a sacrificial mask layer. The method includes forming a plurality of parallel interconnection patterns on a semiconductor substrate. Each of the interconnection patterns has an interconnection and a mask pattern, which are sequentially stacked. Interlayer insulating layer patterns are formed to fill gap regions between the interconnection patterns. The mask patterns are partially etched to form recessed mask patterns that define grooves between the interlayer insulating layer patterns. Then, sacrificial mask patterns filling the grooves are formed. A predetermined region of the interlayer insulating layer patterns is etched using the sacrificial mask patterns as etching masks to form a self-aligned contact hole that exposes a predetermined region of the semiconductor substrate. A spacer is formed of a sidewall of the self-aligned contact hole, and a plug surrounded by the spacer is formed in the self-aligned contact hole.
申请公布号 US2004241974(A1) 申请公布日期 2004.12.02
申请号 US20040846810 申请日期 2004.05.13
申请人 YUN CHEOL-JU;CHUNG TAE-YOUNG 发明人 YUN CHEOL-JU;CHUNG TAE-YOUNG
分类号 H01L21/28;H01L21/60;H01L21/768;(IPC1-7):H01L21/476;H01L21/320;H01L21/44 主分类号 H01L21/28
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