发明名称 |
CMP apparatus, CMP polishing method, semiconductor device and its manufacturing method |
摘要 |
A CMP apparatus is provided for polishing wafers that are substrates to be polished by CMP. The CMP apparatus comprises a stage that is structured to be rotatable and holds a wafer to be polished, a polishing head holding section that holds a polishing head equipped with a polishing pad over the stage, a polishing head storage section that stores replacement polishing heads equipped with polishing pads; and a polishing head replacement mechanism that replaces the polishing head held by the polishing head holding section with the replacement polishing heads stored in the polishing head storage section. |
申请公布号 |
US2004242126(A1) |
申请公布日期 |
2004.12.02 |
申请号 |
US20040803484 |
申请日期 |
2004.03.18 |
申请人 |
TAKEUCHI JUNICHI |
发明人 |
TAKEUCHI JUNICHI |
分类号 |
B24B37/00;B24B37/04;B24B37/30;B24B57/02;H01L21/304;(IPC1-7):B24B49/00;B24B7/19;B24B1/00 |
主分类号 |
B24B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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