发明名称 System and method for testing multiple integrated circuits that are in the same package
摘要 In one embodiment, a test circuit is coupled to receive a first signal from a signal generator such as a test equipment. The test circuit allows access to one or more terminals of a first integrated circuit, a second integrated circuit, or both based at least on the signal. The test circuit may be in the first integrated circuit. The first integrated circuit and the second integrated circuit may be in a single package. In one embodiment, the test circuit routes signals to and from the second integrated circuit, thus allowing the second integrated circuit to be tested as if it was stand-alone. In one embodiment, the test circuit allows access to otherwise inaccessible terminals of the first integrated circuit, the second integrated circuit, or both.
申请公布号 US6825683(B1) 申请公布日期 2004.11.30
申请号 US20020125117 申请日期 2002.04.18
申请人 CYPRESS SEMICONDUCTOR CORPORATION 发明人 BERNDT PAUL D.;BOLANDER JARIE G.;CLARK LEAH S.
分类号 G01R31/317;(IPC1-7):G10R31/02 主分类号 G01R31/317
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