| 摘要 |
An apparatus to solder a plurality of collimators into a housing formed with a plurality of through holes spaced from each other at a predetermined distance along a longitudinal direction thereof includes a housing accommodating part to accommodate the housing. The apparatus also includes a housing dispensing unit including a housing chucking part to chuck the housing accommodated in the housing accommodating part, and a housing carrying part to carry the housing chucking part to a predetermined soldering position. The apparatus includes a plurality of collimator grip units including grip parts, each to grip the plurality of collimators and move near to and distant from each other relative to the soldering position to insert the plurality of collimators into the housing moved to the soldering position. The apparatus includes a soldering unit disposed adjacent to the soldering position, to solder the plurality of collimators into the housing through the through holes of the housing. Therefore, a soldering apparatus and a method for a collimator, in which a collimator assembly is automatically soldered, reduces time taken to manufacture the collimator assembly and increases reliability of the collimator assembly.
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